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07-18-2020, 06:41 PM
Hi Guys
Yes, "trace spacing" implies the same layer.
Between the first two layers is the PCB itself, so no worries BUT pads are the same on both sides.
With three or more layers, you would not use such a thing with tube circuits unless you are combining tubes with blue tooth or some other silly thing
The tube portion would use only the top and bottom layers and no traces of further layers would be routed in the area. The insulation rating between the 3+ layers is not high, and therefore only suitable to the low-voltage applications it is used for.
Modern PCBs begin as blank fibreglass sheet, which is masked, drilled, holes plated and then copper deposited where required, then solder masked. It is a solder mask upon which the third and fourth layers are applied on opposite sides of the board. Further solder masks insulate these from layers 5 and 6, and so on. The extra layer numbering here may be incorrect, but the basic process of adding those layers is correct. Vias can be added between internal layers and there is certainly a lot for the board designer to keep track of. It is these kinds of assemblies where the Restrict layers in Eagle come into play, where routing has to avoid where other layers may have a blind via, or really, to avoid any via or area of concern.
Yes, "trace spacing" implies the same layer.
Between the first two layers is the PCB itself, so no worries BUT pads are the same on both sides.
With three or more layers, you would not use such a thing with tube circuits unless you are combining tubes with blue tooth or some other silly thing
The tube portion would use only the top and bottom layers and no traces of further layers would be routed in the area. The insulation rating between the 3+ layers is not high, and therefore only suitable to the low-voltage applications it is used for.Modern PCBs begin as blank fibreglass sheet, which is masked, drilled, holes plated and then copper deposited where required, then solder masked. It is a solder mask upon which the third and fourth layers are applied on opposite sides of the board. Further solder masks insulate these from layers 5 and 6, and so on. The extra layer numbering here may be incorrect, but the basic process of adding those layers is correct. Vias can be added between internal layers and there is certainly a lot for the board designer to keep track of. It is these kinds of assemblies where the Restrict layers in Eagle come into play, where routing has to avoid where other layers may have a blind via, or really, to avoid any via or area of concern.
