![[-]](https://theultimatetone.com/images/collapse.png "[-]")
02-24-2024, 08:25 PM
(This post was last modified: 02-24-2024, 08:26 PM by physics.
Edit Reason: remove duplicate text
)
That does seem to be the conundrum with PV products. I'm not sure how old the amp is, I'll have to look into how to date it, but I think it's no later than 2010, probably earlier.
Thanks for the advice on desoldering. For my process so far, I've been using a soldapult III to clear the hole first which usually leaves the lead completely unattached so that the component either falls out or can be freely removed. If it has a small joint holding it onto the pad then I'll either reheat (and maybe add solder) and pull the component out while wet or if small enough break the joint and remove the component. The pads have been lifting during the clearing of the hole before even removing the component, despite working fast and with only one try. I didn't find a dedicated desoldering article, will pulling the part out wet first and then clearing after (maybe from the opposite side so as not to suck the pad off the board?) make any difference over what I'm currently doing since the holes are completely cleared by the soldapult? I'm also concerned about dwell times if I'm keeping the solder melted long enough to pull out the component, given some have bent leads that require some finagling.
I also had one pad lift when stuffing a replacement component it. Tried stuffing it wet since the part fell out a bit the first time around leaving solder in the hole, and pushing the part through pushed the pad up. Doh! Won't be doing that again.
I'm also curious what makes power desoldering tools so bad. I would have thought they work better than a hand tool, and have been eyeing the venturi workstand for my metcal station (which I got cheap).
Thanks!
Thanks for the advice on desoldering. For my process so far, I've been using a soldapult III to clear the hole first which usually leaves the lead completely unattached so that the component either falls out or can be freely removed. If it has a small joint holding it onto the pad then I'll either reheat (and maybe add solder) and pull the component out while wet or if small enough break the joint and remove the component. The pads have been lifting during the clearing of the hole before even removing the component, despite working fast and with only one try. I didn't find a dedicated desoldering article, will pulling the part out wet first and then clearing after (maybe from the opposite side so as not to suck the pad off the board?) make any difference over what I'm currently doing since the holes are completely cleared by the soldapult? I'm also concerned about dwell times if I'm keeping the solder melted long enough to pull out the component, given some have bent leads that require some finagling.
I also had one pad lift when stuffing a replacement component it. Tried stuffing it wet since the part fell out a bit the first time around leaving solder in the hole, and pushing the part through pushed the pad up. Doh! Won't be doing that again.
I'm also curious what makes power desoldering tools so bad. I would have thought they work better than a hand tool, and have been eyeing the venturi workstand for my metcal station (which I got cheap).
Thanks!
