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10-03-2018, 12:18 PM
Library parts: Package (part-4)
In the example above, we selected "long" pads and their rotation can be easily seen. It is important that the component lead will fit in the hole, so we must assure that the DRILL size is correct and this will affect the DIAMETER. When we made or acquired the mechanical drawing for the part, the lead size or pin diameter is an important measurement to note; diffucult to do accurately without a caliper.
When we have the virtual pad on the cursor, we can select the DRILL size in the top toolbar by Left-clicking on the scroll-arrow in the DRILL window, then on the drill size needed; then lay the pad on the package editor field.
The diameter of the pad is obvious if it is circular, but as a Long or Offset pad diameter = length. If you select the CHANGE (wrench, spanner) tool in the left-hand toolbar, a menu opens with parameters that can be changed in the package editor. Scroll down to Diameter; left-click; scroll to size you wish to try; left-click; cursor to the pad you wish to change the diameter of; left-click and its diameter will change to the new value. You can left-click on any other pad and its diameter will change to the new value. To stop this change function, left-click on the STOP sign in the top toolbar.
You can change the drill size using the CHANGE function, as well.
It is important that the hole for the lead or component pin be a bit larger than the pin diameter so there is room for solder. generally, 7-mil larger is recommended and this is a minimum for hand-soldering and considered an optimum for wave soldering. It is always better to err on the hole being too large than too tight.
Similarly, when we are soldering the component to the board, it is important that there be enough pad area for the solder to flow outward and wet in the right shape, with a concave surface. The AUTO diameter results in small-ish pads that are fine for very tight spacings and the use of a fine pencil-tip on the iron. For mere mortals, it is better to have larger pad diameters and this improves the reliability of the connection, as well, as larger solder connections last longer.
Where it is best to get these parameters "right" when we initially make the package, we can always go back into the library and change things if we find we made an error. Hopefully this is before boards have been made but in most cases that was how we found the error.
In the example above, we selected "long" pads and their rotation can be easily seen. It is important that the component lead will fit in the hole, so we must assure that the DRILL size is correct and this will affect the DIAMETER. When we made or acquired the mechanical drawing for the part, the lead size or pin diameter is an important measurement to note; diffucult to do accurately without a caliper.
When we have the virtual pad on the cursor, we can select the DRILL size in the top toolbar by Left-clicking on the scroll-arrow in the DRILL window, then on the drill size needed; then lay the pad on the package editor field.
The diameter of the pad is obvious if it is circular, but as a Long or Offset pad diameter = length. If you select the CHANGE (wrench, spanner) tool in the left-hand toolbar, a menu opens with parameters that can be changed in the package editor. Scroll down to Diameter; left-click; scroll to size you wish to try; left-click; cursor to the pad you wish to change the diameter of; left-click and its diameter will change to the new value. You can left-click on any other pad and its diameter will change to the new value. To stop this change function, left-click on the STOP sign in the top toolbar.
You can change the drill size using the CHANGE function, as well.
It is important that the hole for the lead or component pin be a bit larger than the pin diameter so there is room for solder. generally, 7-mil larger is recommended and this is a minimum for hand-soldering and considered an optimum for wave soldering. It is always better to err on the hole being too large than too tight.
Similarly, when we are soldering the component to the board, it is important that there be enough pad area for the solder to flow outward and wet in the right shape, with a concave surface. The AUTO diameter results in small-ish pads that are fine for very tight spacings and the use of a fine pencil-tip on the iron. For mere mortals, it is better to have larger pad diameters and this improves the reliability of the connection, as well, as larger solder connections last longer.
Where it is best to get these parameters "right" when we initially make the package, we can always go back into the library and change things if we find we made an error. Hopefully this is before boards have been made but in most cases that was how we found the error.
